> 제품 > 커넥터, 상호 연결 > IC, 트랜지스터 소켓
Manufacturer Packaging Series ProductStatus Type NumberofPositionsorPins(Grid) Pitch-Mating ContactFinish-Mating ContactFinishThickness-Mating ContactMaterial-Mating MountingType Features Termination Pitch-Post ContactFinish-Post ContactFinishThickness-Post ContactMaterial-Post HousingMaterial
























































































































































































































































































































































































































































































































































































































































































































































































































































































































































모두 재설정
모두 적용
결과:
Photo Mfr. Part # Stock Price Quantity Datasheet Packaging Series ProductStatus Type NumberofPositionsorPins(Grid) Pitch-Mating ContactFinish-Mating ContactFinishThickness-Mating ContactMaterial-Mating MountingType Features Termination Pitch-Post ContactFinish-Post ContactFinishThickness-Post ContactMaterial-Post HousingMaterial
110-41-636-61-001000

110-41-636-61-001000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

2885 QRF
- +

  카트에 추가

  지금 질의

Tube * Active - - - - - - - - - - - - - -
110-91-636-61-001000

110-91-636-61-001000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

2539 QRF
- +

  카트에 추가

  지금 질의

Tube * Active - - - - - - - - - - - - - -
35-71000-10

35-71000-10

CONN SOCKET SIP 35POS TIN

Aries Electronics

2042 QRF
- +

  카트에 추가

  지금 질의

35-71000-10

Datasheet

Bulk 700 Elevator Strip-Line™ Active SIP 35 (1 x 35) 0.100 (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole Elevated Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled
35-7360-10

35-7360-10

CONN SOCKET SIP 35POS TIN

Aries Electronics

2590 QRF
- +

  카트에 추가

  지금 질의

35-7360-10

Datasheet

Bulk 700 Elevator Strip-Line™ Active SIP 35 (1 x 35) 0.100 (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole Elevated Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled
40-823-90C

40-823-90C

CONN IC DIP SOCKET 40POS GOLD

Aries Electronics

2827 QRF
- +

  카트에 추가

  지금 질의

40-823-90C

Datasheet

Bulk Vertisockets™ 800 Active DIP, 0.3 (7.62mm) Row Spacing 40 (2 x 20) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole, Right Angle, Horizontal Closed Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
122-13-648-41-001000

122-13-648-41-001000

CONN IC DIP SOCKET 48POS GOLD

Mill-Max Manufacturing Corp.

2363 QRF
- +

  카트에 추가

  지금 질의

122-13-648-41-001000

Datasheet

Tube 122 Active DIP, 0.6 (15.24mm) Row Spacing 48 (2 x 24) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
116-47-952-41-001000

116-47-952-41-001000

STANDRD SOLDRTL

Mill-Max Manufacturing Corp.

3335 QRF
- +

  카트에 추가

  지금 질의

116-47-952-41-001000

Datasheet

Tube 116 Active DIP, 0.9 (22.86mm) Row Spacing 52 (2 x 26) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
40-820-90C

40-820-90C

CONN IC DIP SOCKET 40POS GOLD

Aries Electronics

3587 QRF
- +

  카트에 추가

  지금 질의

40-820-90C

Datasheet

Bulk Vertisockets™ 800 Active DIP, 0.3 (7.62mm) Row Spacing 40 (2 x 20) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole, Right Angle, Horizontal Closed Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
40-822-90C

40-822-90C

CONN IC DIP SOCKET 40POS GOLD

Aries Electronics

3929 QRF
- +

  카트에 추가

  지금 질의

40-822-90C

Datasheet

Bulk Vertisockets™ 800 Active DIP, 0.3 (7.62mm) Row Spacing 40 (2 x 20) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole, Right Angle, Horizontal Closed Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
24-6574-11

24-6574-11

CONN IC DIP SOCKET ZIF 24POS TIN

Aries Electronics

2886 QRF
- +

  카트에 추가

  지금 질의

24-6574-11

Datasheet

Bulk 57 Active DIP, ZIF (ZIP), 0.6 (15.24mm) Row Spacing 24 (2 x 12) 0.100 (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Through Hole Closed Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Polyphenylene Sulfide (PPS), Glass Filled
24-6571-11

24-6571-11

CONN IC DIP SOCKET ZIF 24POS GLD

Aries Electronics

2642 QRF
- +

  카트에 추가

  지금 질의

24-6571-11

Datasheet

Bulk 57 Active DIP, ZIF (ZIP), 0.6 (15.24mm) Row Spacing 24 (2 x 12) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Solder 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Polyphenylene Sulfide (PPS), Glass Filled
24-3571-11

24-3571-11

CONN IC DIP SOCKET ZIF 24POS GLD

Aries Electronics

2551 QRF
- +

  카트에 추가

  지금 질의

24-3571-11

Datasheet

Bulk 57 Active DIP, ZIF (ZIP), 0.3 (7.62mm) Row Spacing 24 (2 x 12) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Solder 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Polyphenylene Sulfide (PPS), Glass Filled
24-3572-11

24-3572-11

CONN IC DIP SOCKET ZIF 24POS GLD

Aries Electronics

2830 QRF
- +

  카트에 추가

  지금 질의

24-3572-11

Datasheet

Bulk 57 Active DIP, ZIF (ZIP), 0.3 (7.62mm) Row Spacing 24 (2 x 12) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Solder 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Polyphenylene Sulfide (PPS), Glass Filled
24-3573-11

24-3573-11

CONN IC DIP SOCKET ZIF 24POS GLD

Aries Electronics

2495 QRF
- +

  카트에 추가

  지금 질의

24-3573-11

Datasheet

Bulk 57 Active DIP, ZIF (ZIP), 0.3 (7.62mm) Row Spacing 24 (2 x 12) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Solder 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Polyphenylene Sulfide (PPS), Glass Filled
24-3574-11

24-3574-11

CONN IC DIP SOCKET ZIF 24POS TIN

Aries Electronics

3985 QRF
- +

  카트에 추가

  지금 질의

24-3574-11

Datasheet

Bulk 57 Active DIP, ZIF (ZIP), 0.3 (7.62mm) Row Spacing 24 (2 x 12) 0.100 (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Through Hole Closed Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Polyphenylene Sulfide (PPS), Glass Filled
24-6572-11

24-6572-11

CONN IC DIP SOCKET ZIF 24POS GLD

Aries Electronics

2443 QRF
- +

  카트에 추가

  지금 질의

24-6572-11

Datasheet

Bulk 57 Active DIP, ZIF (ZIP), 0.6 (15.24mm) Row Spacing 24 (2 x 12) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Solder 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Polyphenylene Sulfide (PPS), Glass Filled
24-6570-11

24-6570-11

CONN IC DIP SOCKET ZIF 24POS GLD

Aries Electronics

2258 QRF
- +

  카트에 추가

  지금 질의

24-6570-11

Datasheet

Bulk 57 Active DIP, ZIF (ZIP), 0.6 (15.24mm) Row Spacing 24 (2 x 12) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Solder 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Polyphenylene Sulfide (PPS), Glass Filled
24-3570-11

24-3570-11

CONN IC DIP SOCKET ZIF 24POS GLD

Aries Electronics

3962 QRF
- +

  카트에 추가

  지금 질의

24-3570-11

Datasheet

Bulk 57 Active DIP, ZIF (ZIP), 0.3 (7.62mm) Row Spacing 24 (2 x 12) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Solder 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Polyphenylene Sulfide (PPS), Glass Filled
24-6573-11

24-6573-11

CONN IC DIP SOCKET ZIF 24POS GLD

Aries Electronics

3033 QRF
- +

  카트에 추가

  지금 질의

24-6573-11

Datasheet

Bulk 57 Active DIP, ZIF (ZIP), 0.6 (15.24mm) Row Spacing 24 (2 x 12) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Solder 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Polyphenylene Sulfide (PPS), Glass Filled
24-3575-11

24-3575-11

CONN IC DIP SOCKET ZIF 24POS TIN

Aries Electronics

3283 QRF
- +

  카트에 추가

  지금 질의

24-3575-11

Datasheet

Bulk 57 Active DIP, ZIF (ZIP), 0.3 (7.62mm) Row Spacing 24 (2 x 12) 0.100 (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Through Hole Closed Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Polyphenylene Sulfide (PPS), Glass Filled
Total 21991 Records«Prev1... 572573574575576577578579...1100Next»
견적 요청
부품 번호
재다
연락처
이메일
회사
코멘트
  • 심천시이치칩유한공사