> 제품 > 커넥터, 상호 연결 > IC, 트랜지스터 소켓
Manufacturer Packaging Series ProductStatus Type NumberofPositionsorPins(Grid) Pitch-Mating ContactFinish-Mating ContactFinishThickness-Mating ContactMaterial-Mating MountingType Features Termination Pitch-Post ContactFinish-Post ContactFinishThickness-Post ContactMaterial-Post HousingMaterial
























































































































































































































































































































































































































































































































































































































































































































































































































































































































































모두 재설정
모두 적용
결과:
Photo Mfr. Part # Stock Price Quantity Datasheet Packaging Series ProductStatus Type NumberofPositionsorPins(Grid) Pitch-Mating ContactFinish-Mating ContactFinishThickness-Mating ContactMaterial-Mating MountingType Features Termination Pitch-Post ContactFinish-Post ContactFinishThickness-Post ContactMaterial-Post HousingMaterial
28-3570-16

28-3570-16

CONN IC DIP SOCKET ZIF 28POS

Aries Electronics

2745 QRF
- +

  카트에 추가

  지금 질의

28-3570-16

Datasheet

Bulk 57 Active DIP, ZIF (ZIP), 0.3 (7.62mm) Row Spacing 28 (2 x 14) 0.100 (2.54mm) Nickel Boron 50.0µin (1.27µm) Beryllium Nickel Through Hole Closed Frame Solder 0.100 (2.54mm) Nickel Boron 50.0µin (1.27µm) Beryllium Nickel Polyphenylene Sulfide (PPS), Glass Filled
28-6570-16

28-6570-16

CONN IC DIP SOCKET ZIF 28POS

Aries Electronics

3494 QRF
- +

  카트에 추가

  지금 질의

28-6570-16

Datasheet

Bulk 57 Active DIP, ZIF (ZIP), 0.6 (15.24mm) Row Spacing 28 (2 x 14) 0.100 (2.54mm) Nickel Boron 50.0µin (1.27µm) Beryllium Nickel Through Hole Closed Frame Solder 0.100 (2.54mm) Nickel Boron 50.0µin (1.27µm) Beryllium Nickel Polyphenylene Sulfide (PPS), Glass Filled
28-6571-16

28-6571-16

CONN IC DIP SOCKET ZIF 28POS

Aries Electronics

3238 QRF
- +

  카트에 추가

  지금 질의

28-6571-16

Datasheet

Bulk 57 Active DIP, ZIF (ZIP), 0.6 (15.24mm) Row Spacing 28 (2 x 14) 0.100 (2.54mm) Nickel Boron 50.0µin (1.27µm) Beryllium Nickel Through Hole Closed Frame Solder 0.100 (2.54mm) Nickel Boron 50.0µin (1.27µm) Beryllium Nickel Polyphenylene Sulfide (PPS), Glass Filled
28-6573-16

28-6573-16

CONN IC DIP SOCKET ZIF 28POS TIN

Aries Electronics

3707 QRF
- +

  카트에 추가

  지금 질의

28-6573-16

Datasheet

Bulk 57 Active DIP, ZIF (ZIP), 0.6 (15.24mm) Row Spacing 28 (2 x 14) 0.100 (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Through Hole Closed Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Polyphenylene Sulfide (PPS), Glass Filled
28-3571-16

28-3571-16

CONN IC DIP SOCKET ZIF 28POS

Aries Electronics

2819 QRF
- +

  카트에 추가

  지금 질의

28-3571-16

Datasheet

Bulk 57 Active DIP, ZIF (ZIP), 0.3 (7.62mm) Row Spacing 28 (2 x 14) 0.100 (2.54mm) Nickel Boron 50.0µin (1.27µm) Beryllium Nickel Through Hole Closed Frame Solder 0.100 (2.54mm) Nickel Boron 50.0µin (1.27µm) Beryllium Nickel Polyphenylene Sulfide (PPS), Glass Filled
28-3572-16

28-3572-16

CONN IC DIP SOCKET ZIF 28POS

Aries Electronics

2974 QRF
- +

  카트에 추가

  지금 질의

28-3572-16

Datasheet

Bulk 57 Active DIP, ZIF (ZIP), 0.3 (7.62mm) Row Spacing 28 (2 x 14) 0.100 (2.54mm) Nickel Boron 50.0µin (1.27µm) Beryllium Nickel Through Hole Closed Frame Solder 0.100 (2.54mm) Nickel Boron 50.0µin (1.27µm) Beryllium Nickel Polyphenylene Sulfide (PPS), Glass Filled
28-3573-16

28-3573-16

CONN IC DIP SOCKET ZIF 28POS

Aries Electronics

2415 QRF
- +

  카트에 추가

  지금 질의

28-3573-16

Datasheet

Bulk 57 Active DIP, ZIF (ZIP), 0.3 (7.62mm) Row Spacing 28 (2 x 14) 0.100 (2.54mm) Nickel Boron 50.0µin (1.27µm) Beryllium Nickel Through Hole Closed Frame Solder 0.100 (2.54mm) Nickel Boron 50.0µin (1.27µm) Beryllium Nickel Polyphenylene Sulfide (PPS), Glass Filled
28-3574-16

28-3574-16

CONN IC DIP SOCKET ZIF 28POS GLD

Aries Electronics

3153 QRF
- +

  카트에 추가

  지금 질의

28-3574-16

Datasheet

Bulk 57 Active DIP, ZIF (ZIP), 0.3 (7.62mm) Row Spacing 28 (2 x 14) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Solder 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Polyphenylene Sulfide (PPS), Glass Filled
28-6572-16

28-6572-16

CONN IC DIP SOCKET ZIF 28POS TIN

Aries Electronics

2518 QRF
- +

  카트에 추가

  지금 질의

28-6572-16

Datasheet

Bulk 57 Active DIP, ZIF (ZIP), 0.6 (15.24mm) Row Spacing 28 (2 x 14) 0.100 (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Through Hole Closed Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Polyphenylene Sulfide (PPS), Glass Filled
28-6574-16

28-6574-16

CONN IC DIP SOCKET ZIF 28POS TIN

Aries Electronics

3134 QRF
- +

  카트에 추가

  지금 질의

28-6574-16

Datasheet

Bulk 57 Active DIP, ZIF (ZIP), 0.6 (15.24mm) Row Spacing 28 (2 x 14) 0.100 (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Through Hole Closed Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Polyphenylene Sulfide (PPS), Glass Filled
510-41-281-19-081002

510-41-281-19-081002

SKT PGA SOLDRTL

Mill-Max Manufacturing Corp.

2115 QRF
- +

  카트에 추가

  지금 질의

510-41-281-19-081002

Datasheet

Bulk 510 Active PGA 281 (19 x 19) 0.100 (2.54mm) - - Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) - - Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
510-91-281-19-081002

510-91-281-19-081002

SOCKET SOLDERTAIL 281-PGA

Mill-Max Manufacturing Corp.

3173 QRF
- +

  카트에 추가

  지금 질의

Bulk 510 Active PGA 281 (19 x 19) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) - - Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
510-91-281-19-081001

510-91-281-19-081001

SKT PGA SOLDRTL

Mill-Max Manufacturing Corp.

3519 QRF
- +

  카트에 추가

  지금 질의

510-91-281-19-081001

Datasheet

Bulk 510 Active PGA 281 (19 x 19) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
510-91-281-19-081003

510-91-281-19-081003

SKT PGA SOLDRTL

Mill-Max Manufacturing Corp.

2077 QRF
- +

  카트에 추가

  지금 질의

510-91-281-19-081003

Datasheet

Bulk 510 Active PGA 281 (19 x 19) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
550-10-480M29-001166

550-10-480M29-001166

BGA PIN ADAPTER 1.27MM SMD

Preci-Dip

3829 QRF
- +

  카트에 추가

  지금 질의

550-10-480M29-001166

Datasheet

Bulk 550 Active BGA 480 (29 x 29) 0.050 (1.27mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Solder 0.050 (1.27mm) Gold 10.0µin (0.25µm) Brass FR4 Epoxy Glass
517-83-599-54-131111

517-83-599-54-131111

CONN SOCKET PGA 599POS GOLD

Preci-Dip

2914 QRF
- +

  카트에 추가

  지금 질의

517-83-599-54-131111

Datasheet

Bulk 517 Active PGA 599 (54 x 54) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
210-2599-50-0602

210-2599-50-0602

3M TEXTOOL ZIP STRIP SOCKETS 210

3M

3082 QRF
- +

  카트에 추가

  지금 질의

Box - Active - - - - - - - - - - - - - -
48-6503-21

48-6503-21

CONN IC DIP SOCKET 48POS GOLD

Aries Electronics

2669 QRF
- +

  카트에 추가

  지금 질의

48-6503-21

Datasheet

Bulk 503 Active DIP, 0.6 (15.24mm) Row Spacing 48 (2 x 24) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Wire Wrap 0.100 (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled
48-6503-31

48-6503-31

CONN IC DIP SOCKET 48POS GOLD

Aries Electronics

2100 QRF
- +

  카트에 추가

  지금 질의

48-6503-31

Datasheet

Bulk 503 Active DIP, 0.6 (15.24mm) Row Spacing 48 (2 x 24) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Wire Wrap 0.100 (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled
518-77-292M20-001106

518-77-292M20-001106

CONN SOCKET PGA 292POS GOLD

Preci-Dip

2491 QRF
- +

  카트에 추가

  지금 질의

518-77-292M20-001106

Datasheet

Bulk 518 Active PGA 292 (20 x 20) 0.050 (1.27mm) Gold Flash Beryllium Copper Surface Mount Open Frame Solder 0.050 (1.27mm) Gold Flash Brass FR4 Epoxy Glass
Total 21991 Records«Prev1... 685686687688689690691692...1100Next»
견적 요청
부품 번호
재다
연락처
이메일
회사
코멘트
  • 심천시이치칩유한공사