Домой > Продукты > Соединитель, соединитель > IC, транзисторная розетка
Manufacturer Packaging Series ProductStatus Type NumberofPositionsorPins(Grid) Pitch-Mating ContactFinish-Mating ContactFinishThickness-Mating ContactMaterial-Mating MountingType Features Termination Pitch-Post ContactFinish-Post ContactFinishThickness-Post ContactMaterial-Post HousingMaterial
























































































































































































































































































































































































































































































































































































































































































































































































































































































































































Сбросить
Заявления
Последствия:
Photo Mfr. Part # Stock Price Quantity Datasheet Packaging Series ProductStatus Type NumberofPositionsorPins(Grid) Pitch-Mating ContactFinish-Mating ContactFinishThickness-Mating ContactMaterial-Mating MountingType Features Termination Pitch-Post ContactFinish-Post ContactFinishThickness-Post ContactMaterial-Post HousingMaterial
18-6511-10

18-6511-10

SOCKET 18 PIN SOLDER TAIL TIN

Aries Electronics

3609 QRF
- +

Добавить

Расследования

- 511 Active DIP, 0.6 (15.24mm) Row Spacing 18 (2 x 9) 0.100 (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole Closed Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled
117-83-652-41-105101

117-83-652-41-105101

CONN IC DIP SOCKET 52POS GOLD

Preci-Dip

3506 QRF
- +

Добавить

Расследования

117-83-652-41-105101

Datasheet

Bulk 117 Active DIP, 0.6 (15.24mm) Row Spacing 52 (2 x 26) 0.070 (1.78mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Solder 0.070 (1.78mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
116-83-640-41-002101

116-83-640-41-002101

CONN IC DIP SOCKET 40POS GOLD

Preci-Dip

2705 QRF
- +

Добавить

Расследования

116-83-640-41-002101

Datasheet

Bulk 116 Active DIP, 0.6 (15.24mm) Row Spacing 40 (2 x 20) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
117-87-448-41-105101

117-87-448-41-105101

CONN IC DIP SOCKET 48POS GOLD

Preci-Dip

3006 QRF
- +

Добавить

Расследования

117-87-448-41-105101

Datasheet

Bulk 117 Active DIP, 0.4 (10.16mm) Row Spacing 48 (2 x 24) 0.070 (1.78mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.070 (1.78mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
116-87-652-41-002101

116-87-652-41-002101

CONN IC DIP SOCKET 52POS GOLD

Preci-Dip

2915 QRF
- +

Добавить

Расследования

116-87-652-41-002101

Datasheet

Bulk 116 Active DIP, 0.6 (15.24mm) Row Spacing 52 (2 x 26) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
XR2T-2021-N

XR2T-2021-N

CONN IC DIP SOCKET 20POS GOLD

Omron Electronics Inc-EMC Div

3559 QRF
- +

Добавить

Расследования

XR2T-2021-N

Datasheet

Bulk,Box XR2 Active DIP, 0.3 (7.62mm) Row Spacing 20 (2 x 10) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame, Seal Tape Solder 0.100 (2.54mm) Gold Flash Beryllium Copper Polybutylene Terephthalate (PBT), Glass Filled
116-83-642-41-007101

116-83-642-41-007101

CONN IC DIP SOCKET 42POS GOLD

Preci-Dip

3047 QRF
- +

Добавить

Расследования

116-83-642-41-007101

Datasheet

Bulk 116 Active DIP, 0.6 (15.24mm) Row Spacing 42 (2 x 21) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
20-3513-11

20-3513-11

CONN IC DIP SOCKET 20POS GOLD

Aries Electronics

2561 QRF
- +

Добавить

Расследования

20-3513-11

Datasheet

Bulk Lo-PRO®file, 513 Active DIP, 0.3 (7.62mm) Row Spacing 20 (2 x 10) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Solder 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
12-6513-10H

12-6513-10H

CONN IC DIP SOCKET 12POS GOLD

Aries Electronics

3663 QRF
- +

Добавить

Расследования

12-6513-10H

Datasheet

Bulk Lo-PRO®file, 513 Active DIP, 0.6 (15.24mm) Row Spacing 12 (2 x 6) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
08-0503-20

08-0503-20

CONN SOCKET SIP 8POS GOLD

Aries Electronics

2633 QRF
- +

Добавить

Расследования

08-0503-20

Datasheet

Bulk 0503 Active SIP 8 (1 x 8) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole - Wire Wrap 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA), Nylon, Glass Filled
08-0503-30

08-0503-30

CONN SOCKET SIP 8POS GOLD

Aries Electronics

2173 QRF
- +

Добавить

Расследования

08-0503-30

Datasheet

Bulk 0503 Active SIP 8 (1 x 8) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole - Wire Wrap 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA), Nylon, Glass Filled
06-3508-20

06-3508-20

CONN IC DIP SOCKET 6POS GOLD

Aries Electronics

2969 QRF
- +

Добавить

Расследования

06-3508-20

Datasheet

Bulk 508 Active DIP, 0.3 (7.62mm) Row Spacing 6 (2 x 3) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
06-3508-30

06-3508-30

CONN IC DIP SOCKET 6POS GOLD

Aries Electronics

2327 QRF
- +

Добавить

Расследования

06-3508-30

Datasheet

Bulk 508 Active DIP, 0.3 (7.62mm) Row Spacing 6 (2 x 3) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
16-0518-11H

16-0518-11H

CONN SOCKET SIP 16POS GOLD

Aries Electronics

2726 QRF
- +

Добавить

Расследования

16-0518-11H

Datasheet

Bulk 518 Active SIP 16 (1 x 16) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
16-1518-11H

16-1518-11H

CONN IC DIP SOCKET 16POS GOLD

Aries Electronics

2649 QRF
- +

Добавить

Расследования

16-1518-11H

Datasheet

Bulk 518 Active DIP, 0.2 (5.08mm) Row Spacing 16 (2 x 8) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
510-83-100-13-062101

510-83-100-13-062101

CONN SOCKET PGA 100POS GOLD

Preci-Dip

3068 QRF
- +

Добавить

Расследования

510-83-100-13-062101

Datasheet

Bulk 510 Active PGA 100 (13 x 13) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
510-83-100-13-063101

510-83-100-13-063101

CONN SOCKET PGA 100POS GOLD

Preci-Dip

3391 QRF
- +

Добавить

Расследования

510-83-100-13-063101

Datasheet

Bulk 510 Active PGA 100 (13 x 13) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
510-83-100-13-064101

510-83-100-13-064101

CONN SOCKET PGA 100POS GOLD

Preci-Dip

3752 QRF
- +

Добавить

Расследования

510-83-100-13-064101

Datasheet

Bulk 510 Active PGA 100 (13 x 13) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
117-93-640-41-005000

117-93-640-41-005000

CONN IC DIP SOCKET 40POS GOLD

Mill-Max Manufacturing Corp.

2586 QRF
- +

Добавить

Расследования

117-93-640-41-005000

Datasheet

Tube 117 Active DIP, 0.6 (15.24mm) Row Spacing 40 (2 x 20) 0.070 (1.78mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.070 (1.78mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
117-43-640-41-005000

117-43-640-41-005000

CONN IC DIP SOCKET 40POS GOLD

Mill-Max Manufacturing Corp.

3677 QRF
- +

Добавить

Расследования

117-43-640-41-005000

Datasheet

Tube 117 Active DIP, 0.6 (15.24mm) Row Spacing 40 (2 x 20) 0.070 (1.78mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.070 (1.78mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Total 21991 Records«Prev1... 191192193194195196197198...1100Next»
Запрос котировок
Номер запчасти
Количество
Связь
Электронная почта
Компания
Замечания
  • Шэньчжэньская компания по производству чипов